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| Place of Origin: | China |
| اسم العلامة التجارية: | OEM |
The Multi Wire Saw Machine is a cutting-edge solution designed specifically for the precise cutting of Silicon Wafers. With its advanced technology and high-performance capabilities, this machine is the ideal choice for industries requiring accuracy and efficiency in wire cutting processes.
One of the key features of the Multi Wire Saw Machine is its ability to use multiple wires simultaneously, allowing for enhanced cutting productivity and speed. The machine is equipped with cutting-edge technology that ensures smooth and precise cutting of Silicon Wafers with a wire thickness of 0.55mm.
With a total power of 300kw, the Multi Wire Saw Machine delivers exceptional cutting performance while maintaining energy efficiency. This power capacity enables the machine to handle various cutting tasks with ease, making it a versatile and reliable tool for industries working with Silicon Wafers.
Equipped with a one-year warranty, the Multi Wire Saw Machine offers peace of mind to users, ensuring that any potential issues or defects will be promptly addressed and resolved. This warranty coverage reflects the high quality and durability of the machine, providing customers with confidence in their investment.
The Multi Wire Saw Machine is designed to handle processing thickness ranging from 5mm to 30mm, making it suitable for a wide range of cutting requirements. Whether you need to cut thin Silicon Wafers or thicker materials, this machine offers the flexibility and precision needed to achieve optimal results.
In conclusion, the Multi Wire Saw Machine is a cutting-edge solution for industries requiring precise and efficient wire cutting processes. With its multiple wire capabilities, 0.55mm wire thickness, 300kw total power, one-year warranty, and processing thickness range of 5-30mm, this machine is a top-of-the-line tool for cutting Silicon Wafers with unparalleled accuracy and performance.
| Electric System | Siemens |
| Dimensions | 5000*3000*2000mm |
| Cooling System | Water Cooling |
| Power Consumption | 20kW |
| Main Power | 60kW |
| Usage | Cutting Silicon Wafers |
| Wire Thickness | 0.55mm |
| Model | MW-1000 |
| Processing Thickness | 5-30mm |
| Cutting Method | Multi-wire Sawing |
The Multi Wire Saw Machine offered by OEM is a cutting-edge product originating from China, designed for precision cutting of silicon wafers. With its advanced technology and high efficiency, this Multiple Wire Saw Machine is ideal for various applications in the semiconductor industry.
Equipped with a water cooling system, this Multi Wire Saw Machine ensures optimal performance and longevity during continuous operation. The Stone Lifting Type lifting method enhances convenience and safety during the cutting process, making it suitable for industrial use.
The 0.1mm wire diameter of this Multiple Wire Saw Machine allows for extremely fine and accurate cuts, meeting the strict requirements of silicon wafer production. With a total power of 300kw, the machine delivers exceptional cutting power and speed, maximizing productivity in manufacturing processes.
The Multi Wire Saw Machine is versatile and can be used in various scenarios, such as in semiconductor fabrication facilities, research laboratories, and silicon wafer production plants. Its precision cutting capabilities make it an essential tool for producing high-quality silicon wafers used in electronics and solar energy applications.
Whether cutting silicon ingots or slicing wafers for solar cell production, this Multiple Wire Saw Machine offers unparalleled performance and reliability. Its robust design and efficient cooling system make it a dependable solution for demanding cutting tasks in the semiconductor industry.
In conclusion, the Multi Wire Saw Machine from OEM is a top-of-the-line product that excels in cutting silicon wafers with precision and efficiency. Its advanced features, including water cooling, stone lifting type, and 0.1mm wire diameter, make it a valuable asset for businesses involved in semiconductor manufacturing and research.
Product Customization Services for the Multi Wire Saw Machine
Brand Name: OEM
Place of Origin: China
Warranty: One Year
Power Consumption: 20kW
Usage: Cutting Silicon Wafers
Wire Diameter: 0.1mm
Cooling System: Water Cooling
The Product Technical Support and Services for the Multi Wire Saw Machine include:
- Installation assistance and guidance
- Troubleshooting support for any operational issues
- Regular maintenance services to ensure optimal performance
- Training sessions for operators on how to use the machine efficiently
- Access to online resources and documentation for reference
Q: What is the brand name of the Multi Wire Saw Machine?
A: The brand name of the Multi Wire Saw Machine is OEM.
Q: Where is the Multi Wire Saw Machine manufactured?
A: The Multi Wire Saw Machine is manufactured in China.
Q: What is the cutting capacity of the Multi Wire Saw Machine?
A: The cutting capacity of the Multi Wire Saw Machine varies depending on the model, ranging from X to Y.
Q: Does the Multi Wire Saw Machine come with a warranty?
A: Yes, the Multi Wire Saw Machine comes with a standard warranty. Please refer to the product documentation for more details.
Q: Is the Multi Wire Saw Machine suitable for cutting marble and granite?
A: Yes, the Multi Wire Saw Machine is designed to cut various materials, including marble and granite, with precision and efficiency.
